TM 11-5815-602-10
EE161-DM-OPI-010/E154UGC74
TO 31W4-2UGC74-1
a. In the Self-Test condition, the system performs a series of tests on its circuitry with
operator assistance, to determine the operational readiness and reliability of the system.
(1) The purpose of Self-Test is to examine the following assemblies of the system:
CPU circuit card assembly 3A1A1.
q
Printer circuit card assembly 3A1A4.
q Memory circuit card assembly (if present) 3A1A2.
Communications circuit card assembly 3A1A3.
q Keyboard (if present).
(2) If the memory circuit card assembly and/or keyboard are not present during the test,
the system passes over that assembly and proceeds to the next test.
Upon initiation of the Self-Test, the system automatically erases all
messages in memory. For this reason, any messages in message memory
should be printed out prior to the Self-Test being initiated.
(3) If, at any time, a test fails, the system will (if possible):
Print out a "FAIL" message.
q
Call out the assembly being tested at the time of failure.
q
Example: A1A2 FAIL (test failed during memory circuit card assembly test)
(4) All testing stops during Self-Test when a test fails.
q Operator must notify organizational maintenance for corrective action.
(5) After corrective action, Self-Test must be repeated for the following reasons:
q To confirm that the fault has been corrected.
q To test any assemblies not tested previously because of the failure.
(6) The system power supply is not tested as an independent test, but rather by usage.
(7) The power supply capability is tested while performing the other test.
(8) The power supply may fail completely when power is applied and the Self-Test START
switch is activated.
(9) Power supply may partially fail when low voltage is supplied to assemblies.
q These occurrences must be recognized by the operator as system failures.
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